Daud ND, Nafea M, Mohamed Ali MS. Finite element analysis of material removal rate for Si wafer using Heat-assisted µEDM. Elektrika [Internet]. 2021 Sep. 15 [cited 2024 Apr. 21];20(2-2):15-9. Available from: https://elektrika.utm.my/index.php/ELEKTRIKA_Journal/article/view/301